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Semiconductors, Microelectronics & Data Storage
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  3. Semiconductors, Microelectronics & Data Storage

无论是更复杂和智能系统的需求，无论是在家里，在汽车或手掌中，您的手在半导体和微电子工业的各个方面都会推动无情的发展。是否在电动汽车中分析用于电力分布的装置中的缺陷，通过封装（SIP）装置的系统中的通过硅互连或制造过程中的污染物颗粒的丰度和化学物质，重要的是具有可用于解决的工具任何挑战。

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故障识别和隔离
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元素和结构表征
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Process control and particle analysis

Application Notes

查看我们所有的半导体，微电子和数据存储应用笔记

PCB的污染调查

This application note demonstrates a SEM based solution combined with EDS for the detection and characterisation of contamination on two PCB samples in the analysis of the failures of PCBs.

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DiallsProbe - 柔性电子分析

DiallayProbe使分析者能够分离基板和结构的贡献，并能够以高分辨率和非破坏性方式测量厚度和组成。

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Applying nanomanipulation to the EBSD analysis of a gold wire

This application note describes a method of combining Oxford Instrument’s OmniProbe tools and AZtec EBSD system for the manipulation and analysis of a 5μm diameter gold microelectronic wire sample.

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Analysing a NAND Flash memory device using low kV EDS

The combination of X-Max Extreme with GeminiSEM 500 provides a uniquely convenient and powerful imaging and analysis tool for investigating the morphology and chemistry of nano-structures down to less than 10nm. Using the example of ferrocerium nano-particles and GaInAs quantum dots this capability is demonstrated in practice…

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EBSD.Applications in the Electronics Industry

This application note provides several brief examples of the use of the EBSD technique and, in particular, the Symmetry S2 detector and the AZtecCrystal data processing software, for the effective characterisation of microstructures in a range of microelectronics samples.

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High quality TEM lamella preparation and on-tip analysis using LayerProbe and the OmniProbe 400

Here we present a new technique that enables measurement of the local thickness and composition of TEM lamellae and discuss its application to the failure analysis of semiconductor devices.

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